What is Copper Clad Laminate(CCL)? Types, Application & Selection

CCL generally refers to copper-clad laminates. As the substrate material in the manufacture of printed circuit boards, it mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, the energy loss and characteristic impedance of signals in the circuit.This article briefly introduces copper-clad laminates, covering their definition, capability, and selection.

What is copper clad laminate

The main material for manufacturing printed circuit boards is copper clad laminate, and the insulating laminate covered with copper foil is called copper clad laminate. It is the main material for making circuit boards by corroding copper foil. There are many types of copper-clad laminates, which can be divided into paper-based copper-clad laminates and glass cloth copper-clad laminates according to the type of substrate; according to the bonding resin, there are phenolic copper-clad laminates, epoxy phenolic copper-clad laminates, and polytetrafluoroethylene copper-clad laminates.

Copper Clad Laminate
Copper Clad Laminate

Due to their own performance characteristics, different types of copper clad laminates are applicable to different product ranges. Please refer to the table below for details.

Capability of Copper Clad Laminate

Characteristics of Several Commonly Used Copper Clad Laminates

Nominal Thickness
(mm)

Copper Foil Thickness
(μm)

Characteristics

Typical Application

1.0,1.5,2.0,2.5,
3.0,3.2,6.4

50~70

Low price, easy to absorb water, not resistant to high temperature, poor flame retardancy

Medium and low-end consumer electronics products, such as radios, tape recorders, etc.

ditto

35-70

The price is higher than that of phenolic paper substrate, and the mechanical strength, high temperature resistance and humidity resistance are better

Instruments with a good working environment and medium and high-end consumer electronic products

0.2,0.3,0.5,1.0,1.5,
2.0,3.0,5.0,6.4

35-50

The price is higher, the performance of the substrate is better than that of phenolic cardboard and it is transparent

High-end electronic products such as industrial equipment or computers

0.25,0.3,0.5,0.8,
1.0,1.5.2.0

35-50

High price, good dielectric properties, high temperature resistance, corrosion resistance

UHF (microwave), aerospace and military products

0.2,0.5,0.8,1.2,
1.6,2.0

35

Lightweight for making flexible printed circuit boards

Industrial equipment or consumer electronics, such as computers, appliances and watches, etc.

Through the above table, you can understand the characteristics of these five types of copper clad laminates and their common uses. This can further help you choose the copper clad laminate that meets your needs.

Selection of Copper Clad Laminates

① Choice of copper foil thickness: The thickness of the printed circuit board copper grid is: 10μm, 18μm, 35μm, 50μm, 70μm, etc. For narrower conductive lines, choose a plate with thinner copper foil, otherwise choose a thicker one. Generally choose 35μm and 50μm thick.

② Selection of the thickness of the plate: The nominal thickness of the commonly used copper clad laminates are: 0.5, 0.7, 0.8, 1.0, 1.2, 1.5, 1.6, 2.0, 2.4, 3.2, 6.4 (unit mm). Electronic instruments and general-purpose equipment generally use 1.5mm. For power boards and boards with high-power devices or heavy objects and large-sized circuit boards, 2.0—3.0mm boards can be used.

Selection of Copper Clad Laminates

Conclusion

Copper clad laminate is the basic material for PCB, and it is also an indispensable and important material for electronic products. Through this article, we know that different types of copper clad laminates have their own performance characteristics and corresponding application ranges, and know how to choose and use according to different thicknesses. In the next article, we will continue to explain the copper clad laminate in depth.

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