Vertical Probe Card
Manufactured with advanced products such as Cobra Probes, Pogo PINs and Wire PINs, our Vertical Probe Cards are designed for advanced package testing of logic computing chips. The vertical design is especially suited for contact testing of solder balls (BGA) and copper pillars (Cu Pillar), ensuring efficient and accurate test results.
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About Vertical Probe Card Characteristic
- Offers a range of MEMS probes with diameters ranging from 25um to 75um
- Special needle tip treatment to reduce contact impedance
- Enhances CCC capability up to 1.2A
- Supports minimum 45um pitch
- Pre-production simulation ensures controlled needle pressure from 0.8 to 1.5gf
How strong is the output we can handle
Our production capacity is your guarantee
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Upgrade your probe card performance with our expert PCB designs.