Reliable PCB Stencil Manufacturer
Looking for a reliable PCB stencil manufacturer with tight tolerances, fast lead time, and professional DFM support?
We provide high-precision laser-cut stainless steel stencils engineered for superior solder paste printing and higher SMT yield.
- Laser-Cut Accuracy ±0.01 mm
- 01005 / 0201 / 0.3 mm BGA Compatible
- Nano-Polish & Nano-Coating Options
Why We Are a Trusted PCB Stencil Manufacturer
With over 12 years of experience, we are a professional PCB stencil manufacturer offering complete in-house production — from DFM review to laser cutting, polishing, coating, and final inspection.
Our manufacturing capability includes:
Daily capacity: 200+ stencils
Advanced fiber-laser cutting machines
Microscope inspection for every aperture
Engineers with 10+ years SMT experience
OEM/ODM support for EMS providers, brands & factories
Types of PCB Stencils We Manufacture
Laser-Cut Stainless Steel PCB Stencil
Our standard laser-cut stencil made from SUS304/SUS430 steel provides stable aperture accuracy (±0.01mm) and is suitable for most SMT components, including 0402, 0201, QFN, and fine-pitch ICs.
Electropolished (Nano-Polish) Stencil
This stencil features smoother aperture walls for better paste release, reduced bridging, and improved yield. Ideal for micro-pitch BGAs and precision assemblies.
Nano-Coating PCB Stencil
A hydrophobic nano-coating improves solder paste transfer efficiency and reduces cleaning frequency. Recommended for high-viscosity paste and HDI PCB designs.
Framed & Frameless SMT Stencils
Framed stencils offer maximum tension and stability for mass production, while frameless stencils are cost-effective options for prototypes and small-batch SMT runs.

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PCB Stencil Materials & Thickness Options
Stencil Materials
| Material | Description | Suitable Applications |
|---|---|---|
| SUS304 Stainless Steel | Most commonly used, stable hardness, excellent durability | General SMT printing, consumer electronics |
| SUS430 Stainless Steel | Higher magnetic properties, good cost-performance | Mass production, standard SMT processes |
| High-Tension Fine-Grain Steel | Finer grain structure, higher tension, smoother cut quality | Micro-pitch BGA, 01005/0201, high-precision assemblies |
Available Thickness Options
| Thickness | Recommended Use | Typical Components |
|---|---|---|
| 0.10 mm | Ultra-fine pitch SMT, HDI boards | 01005, 0201, micro-pitch BGA |
| 0.12 mm | Standard solder paste volume, most PCBA builds | 0402, 0603, QFN |
| 0.13 mm | Slightly higher paste volume, mixed-package assembly | QFN, TQFP, connectors |
| 0.15 mm | Larger pads or heavy solder requirements | Power devices, LED, large pads |
| 0.18 mm | Very high solder deposit | Thick pads, heavy mechanical components |
Aperture Precision & Tolerance
| Specification | Value |
|---|---|
| Aperture Tolerance | ±0.01 mm |
| Cutting Accuracy | High-precision fiber-laser |
| Surface Options | Raw steel / Nano-Polish / Nano-Coating |
| Max Stencil Size | Customizable |
Frequently Asked Questions
A reliable PCB stencil manufacturer should offer precision laser cutting, stable stainless-steel materials, strict QC inspection, and DFM aperture optimization. Factory-level production, not reselling, is key for consistent quality.
We accept Gerber, ODB++, DXF, PDF, and pick-and-place files. Engineers will review your data before manufacturing to ensure the stencil design is correct.
0.12 mm is the most common choice. 0.10 mm is recommended for fine-pitch (01005/0201), while 0.15–0.18 mm is used for larger pads or LED applications. We can advise based on your PCB design.
Yes. We manufacture both framed stencils for mass production and frameless stencils for prototypes and small-batch SMT assembly.
Standard production time is 24 hours. Same-day and rush orders are available depending on your requirement and location.
Yes. Our engineers provide free DFM and aperture optimization, including thermal pad reduction, BGA windowpane design, and adjustments for better solder paste release.